Low loss SiN PIC fabrication and its heterogeneous integration with TFLN / III-V

a leading European manufacturer of Photonic Integrated Circuits (PICs) providing access to state-of-the-art technologies. We develop high-performance solutions and fabricate photonic chips for computing, connectivity, and sensing  — at any volume. Through engineering excellence and customer-focused services, we enable products based on integrated photonics.

LIGENTEC provides open-access to its mature modular technologies for low loss integrated photonics based on Silicon Nitride (SiN), including advanced heterogeneous integration with Thin-film Lithium Niobate (TFLN) and III-V materials.

The technology is accessible via full dedicated runs, Multi-Project Wafer (MPW) runs, and customer-specific developments. We also offer the whole spectrum of support services: from feasibility studies, to design and layout support, and high-throughput testing.